Description

FS bondplex bis-Aminopropyl Diglycol Dimaleate is a novel personal care ingredient primarily used for hair repair, it  can be mixed in with hair bleaching products to minimize damage, or it can be used as a separate treatment ie in hair serums, conditioners. The hair shaft, composed primarily of a fibrous protein called keratin, derives its strength and resilience from various types of bonds, notably the disulfide bond. The disulfide bond, a crucial component of the hair’s structural integrity, forms between two sulfur atoms present in adjacent cysteine amino acid residues along the protein chain. Strong bonds are vital for hairs strength, health, elasticity and flexibility, FS bondplex works on a molecular to repair disulfide bonds and restore hair strength.

• Damaged Hair: For hair that’s heavily damaged from frequent coloring, bleaching, or heat styling, FS BONDPLEX can be highly effective. It helps to rebuild broken disulfide bonds within the hair structure, which are often damaged during chemical treatments.
•  Curly or Coily Hair: Curly and coily hair types are  more prone to breakage. It can help strengthen these hair types and improve overall manageability by repairing damage and reducing frizz.
• Thick or Coarse Hair: Thick or coarse hair often requires more intensive treatments to penetrate the hair shaft effectively. It can still be beneficial for these hair types, but leave-on treatments or products with higher concentrations may be more effective.
• Healthy Hair: For those with relatively healthy, undamaged hair, it can still provide benefits by strengthening the hair and preventing future damage.

INCI: Bis-Aminopropyl Diglycol Dimaleate
Usage Rate: 5 – 30%
Add to cool down phase below 60oC

Disclaimer: Our products are for cosmetic, personal care formulations and are meant for external use only. We recommend working with a chemist or a formulator if you’re not advanced in formulating, Kindly note you are responsible for researching,  testing, and understanding ingredients before buying.